Supported memory types ddr3 1066 sdram. How to find out the type of RAM. DDR3: some technical information

Now, when choosing the DDR3 type for your computer or laptop, you can see not just DDR3, but also DDR3L. In this article you will find out how DDR3 differs from DDR3L and whether they are compatible with each other.

Differences between DDR3 and DDR3L

The most basic and only difference between these modules is the operating voltage. For classic DDR3 it is equal to 1.5V, and the newer DDR3L - 1.35V.

You can distinguish them by their markings.

Marking of DDR3 and DDR3L RAM modules

Thus, DDR3L is 10% more economical in terms of power consumption. A similar modernization already took place several years ago, when there was a massive transition from DDR RAM to DDR2. Back then DDR worked on 2.5 volts, while for DDR2 the operating voltage was 1.8 Volt.

DDR3 and DDR3L compatibility

We can say with complete confidence that DDR3L memory with a voltage of 1.35V will work without any problems in all motherboards and laptops with the DDR3 memory standard.

Therefore, when buying DDR3L, you don’t have to worry that it won’t work in your device. Will earn 100%.

The presence of the letter L in the marking is a sign of DDR3L 1.35V memory, which works everywhere and with everything

But if you have a computer manufactured in 2016 or later, then with a very high probability DDR3 1.5V memory may not fit into it. More precisely, you will insert it into the connector, but it will not work, since only 1.35V is supplied to the DIMM memory slot, instead of the 1.5V required for this RAM.

This is especially true for laptops and netbooks, where during design there is a struggle for every volt.

In this article we will look at 3 types of modern RAM for desktop computers:

• DDR- is the oldest type of RAM that can still be bought today, but its dawn has already passed, and this is the oldest type of RAM that we will consider. You will have to find not new motherboards and processors that use this type of RAM, although many existing systems use DDR RAM. The operating voltage of DDR is 2.5 volts (usually increases when the processor is overclocked), and is the largest consumer of electricity among the 3 types of memory we are considering.
• DDR2- This is the most common type of memory used in modern computers. This is not the oldest, but not the newest type of RAM. DDR2 is generally faster than DDR, and therefore DDR2 has a data transfer speed greater than the previous model (the slowest DDR2 model is equal in speed to the fastest DDR model). DDR2 consumes 1.8 volts and, like DDR, the voltage usually increases when overclocking the processor
• DDR3- fast and new type of memory. Again, DDR3 is faster than DDR2, and thus the slowest speed is the same as the fastest DDR2 speed. DDR3 consumes less power than other types of RAM. DDR3 consumes 1.5 volts, and a little more when overclocking the processor

Table 1: Technical characteristics of RAM according to JEDEC standards

JEDEC- Joint Electron Device Engineering Council

The most important characteristic on which memory performance depends is its bandwidth, expressed as the product of the system bus frequency and the amount of data transferred per clock cycle. Modern memory has a bus width of 64 bits (or 8 bytes), so the bandwidth of DDR400 memory is 400 MHz x 8 Bytes = 3200 MB per second (or 3.2 GB/s). Hence, another designation for memory of this type follows - PC3200. Recently, dual-channel memory connections are often used, in which its (theoretical) bandwidth is doubled. Thus, in the case of two DDR400 modules, we will get the maximum possible data transfer speed of 6.4 GB/s.

But maximum memory performance is also affected by such important parameters as “memory timings”.

It is known that the logical structure of a memory bank is a two-dimensional array - the simplest matrix, each cell of which has its own address, row number and column number. To read the contents of an arbitrary array cell, the memory controller must specify the RAS (Row Adress Strobe) row number and the CAS (Column Adress Strobe) column number, from which the data is read. It is clear that there will always be some kind of delay (memory latency) between issuing a command and its execution, which is what these timings characterize. There are many different parameters that determine timings, but the four most commonly used are:

• CAS Latency (CAS) - the delay in clock cycles between the application of the CAS signal and the direct output of data from the corresponding cell. One of the most important characteristics of any memory module;
• RAS to CAS Delay (tRCD) - the number of memory bus clock cycles that must pass after the RAS signal is applied before the CAS signal can be applied;
• Row Precharge (tRP) - the time it takes to close a memory page within one bank, spent on recharging it;
• Activate to Precharge (tRAS) - strobe activity time. The minimum number of cycles between the activation command (RAS) and the recharge command (Precharge), which ends work with this line, or closing the same bank.

If you see the designations “2-2-2-5” or “3-4-4-7” on the modules, you can rest assured that these are the parameters mentioned above: CAS-tRCD-tRP-tRAS.

Standard CAS Latency values ​​for DDR memory are 2 and 2.5 clock cycles, where CAS Latency 2 means that data will be received only two clock cycles after receiving the Read command. In some systems, values ​​of 3 or 1.5 are possible, and for DDR2-800, for example, the latest version of the JEDEC standard defines this parameter in the range from 4 to 6 clock cycles, while 4 is an extreme option for selected “overclocker” chips. The latency of RAS-CAS and RAS Precharge is usually 2, 3, 4 or 5 clock cycles, while tRAS is slightly longer, from 5 to 15 clock cycles. Naturally, the lower these timings (at the same clock frequency), the higher the memory performance. For example, a module with a CAS latency of 2.5 typically performs better than one with a latency of 3.0. Moreover, in a number of cases, memory with lower timings, operating even at a lower clock frequency, turns out to be faster.

Tables 2-4 provide general DDR, DDR2, DDR3 memory speeds and specifications:

Table 2: General DDR Memory Speeds and Specifications

Table 3: General DDR2 Memory Speeds and Specifications

Table 4: General DDR3 Memory Speeds and Specifications

DDR3 can be called a newcomer among memory models. Memory modules of this type have only been available for about a year. The efficiency of this memory continues to increase, only recently reaching the JEDEC limits, and beyond these limits. Today, DDR3-1600 (JEDEC's highest speed) is widely available, and more manufacturers are already offering DDR3-1800). DDR3-2000 prototypes have been shown on the current market and should go on sale late this year or early next year.

The percentage of DDR3 memory modules entering the market according to manufacturers is still small, in the range of 1%-2%, which means that DDR3 has a long way to go before it matches DDR sales (still in the range of 12%- 16%) and this will allow DDR3 to approach DDR2 sales. (25%-35% according to manufacturers’ indicators).

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DDR type RAM assembled according to standards DIMM, which is actually its predecessor. Information can be transmitted both along the front and the bottom due to the fact that the platform is equipped microcircuits and transistors assembled in TSOPBGA. Information may be transmitted to double size in one clock cycle, all thanks to the introduction of the new 2n Prefetch computer architecture.

Among computer technologies, something new is constantly appearing. Now microcircuits for DDR3 type modules are manufactured exclusively in housings of the following type: BGA. Thanks to this, it was possible to improve transistors and models with double shutter

Features of DDR3 memory

RAM sticks come from 1 gigabyte up to 16 gigabytes, and the memory frequency can vary from 100 before 300 MHz. If we talk about the tire, then from 400 before 120 MHz.

More or less normal bus frequency value 1066 – 1600 MHz. If it increases, so does energy consumption along with it. If the frequency is 2400, the strips will heat up and be very hot. To prevent this from happening, install a passive cooling.

Energy consumption may also increase if there is accelerate computer. This happens thanks to transformations, used inside DDR3 voltage Vddr strips.

The memory structure of this type contains 8 memory banks, and the string of its chip is the size 2048 bytes. This building entails decent timings in the operation of RAM and reduces the speed of switching between chips.

The design of the DDR3L strips is practically is not different from DDR3. They are also equipped 240 contacts and have the same dimensions, except for height.

Also, this type is equipped with a system passive cooling, which allows it accelerate, increases performance because rises power consumption. The memory module will not fail earlier than expected, since the heat will dissipate and overheating will not occur.

It is worth noting that since 2012 you can find on the market modifications of this memory designed for DDR3L-RS smartphones.

In memory labeling, L is Low, that is, low energy consumption. Unlike DDR3, this type of memory requires a source whose voltage is 1.35 V. This is 10-15% less than DDR3 and 40% less than DDR2. Due to the fact that less heat is generated, passive cooling not necessary, but it reduces timings and makes work more stable and productive. All other characteristics are no different from DDR3.

DDR3L cannot be replaced with DDR3 because installation in the slot for the first type will lead to incompatibility and startup will not occur. But in reverse order possible replacement, however the board may become hot as DDR3 requires more power.

What is the difference between DDR3 and DDR3L

As we already said, DDR3L is different sizes, but not significantly. Next she consumes less energy by 15 percent and produces little heat. Thereby performance much more, and timings are shorter. This type works more stable and many times faster.

Random access memory (RAM) is a temporary memory module that is used in computer architecture to store a specific set of instructions and information. ensures stable and reliable operation of the operating system and running programs and applications.

With the development of technology, RAM has constantly improved: its volume and performance have increased. The modern type of DDR3 RAM is a modernized version of its “ancestor”, which replaced DIMM-type RAM in the distant 90s.

DDR design

Before determining the differences between DDR3 and DDR3L, you should familiarize yourself with the design of DDR RAM. The RAM is assembled in the form factor of its predecessor, DIMM. The platform was equipped with microcircuits that are assembled in TSOP BGA and transistor packages, thanks to which information was transmitted both along the leading edge and the falling edge. Double data transfer in one clock cycle is made possible by implementing 2n Prefetch technology in the computer architecture.

The development of computer technologies and the introduction of innovative technologies into production has led to the fact that chips for DDR3 type random access memory modules began to be manufactured only in BGA packages. This also contributed to the modernization of transistors, and new models with a double Dual-gate appeared. The use of this technology made it possible to reduce the amount of leakage currents and increase the performance of RAM. So, during its development, the power consumption of the memory block decreased: DDR - 2.6 V, DDR2 - 1.8 V and DDR3 - 1.5 V.

Attention! Memory modules of DDR2 and DDR3 types are not compatible and are not interchangeable in terms of mechanical and electrical parameters. Protection against installing a RAM stick in the wrong slot (connector) is implemented by locating the key in different places on the module.

Features of DDR3 RAM

RAM strips are available from 1 GB to 16 GB, and memory frequencies can be in the range of 100 - 300 MHz, and buses from 400 to 120 MHz. Depending on the bus frequency, DDR3 RAM has different bandwidths:

• DDR3-1600 – from 2400 to 2500 MB/sec;
• DDR3-1866 – from 2800 to 2900 MB/sec;
• DDR3-2133 – from 3200 to 3500 MB/sec;
• DDR3-2400 – from 3400 to 3750 MB/sec.

The optimal values ​​for the memory bus frequency are 1066 – 1600 MHz. As the frequency increases, the power consumption of the memory module increases up to 1.65 V at a bus frequency of 2400 MHz. This phenomenon leads to heating of the slats and an abundant release of thermal energy. To eliminate this drawback, high-performance RAM boards are equipped with a passive cooling system, i.e., aluminum alloy radiators, which are installed with double-sided adhesive tape-thermal interface.

Energy consumption can also increase when overclocking the computer or performing certain actions (operations). This is carried out by internal converters due to the use of Vddr voltage in DDR3 RAM strips. It should be remembered that this also leads to excessive heat generation.

Attention! The release of an amount of thermal energy above the set value leads to a decrease in the overall performance of the computer, causing the operating system and running programs to freeze and slow down.

The DDR3 structure has 8 memory banks, and the line size of its chip is 2048 bytes. A similar structure, as well as disadvantages of SSTL technology, due to which current leaks are possible, long timings appear in the operation of the random access memory device. This also results in relatively slow switching between memory chips.

Features of DDR3L RAM

The design of DDR3L RAM memory sticks is similar to DDR3. They have the same 240 contacts, the overall dimensions are the same except for the height, it is 28 - 32.5 mm versus 30.8 mm for DDR3. This difference is determined by the presence of radiators, depending on the model and manufacturer of the device.

Equipping DDR3L RAM with a passive cooling system provides the ability to overclock it and increase performance by increasing power consumption. This solution makes it possible to effectively remove and dissipate abundantly released thermal energy to prevent overheating and premature failure of the memory module. The sizes of RAM installed in are comparable to standard DDR3 boards. Most of these memory modules on the computer market are available in versions without cooling radiators. This decision comes down to the fact that this class of PC is of little use for upgrading and overclocking.

Attention! At the beginning of 2012, a version of this modification of the DDR3L-RS RAM appeared on the market; it was specially designed for smartphones.

The “L” index in the DDR3L RAM marking means Low – reduced power consumption. This modification of RAM, compared to DDR3, requires a power source with a voltage of 1.35 V. This upgrade leads to a reduction in power consumption by 10 - 15% compared to DDR3 and up to 40% relative to DDR2, reducing the heating of the device. That is, reduced heat generation makes it possible to eliminate passive cooling and leads to shorter timings, increased performance and stability of the device. The remaining technical characteristics of DDR3L RAM are comparable to its “ancestor” DDR3.

Compatibility and interchangeability of DDR3 to DDR3L can only be done in reverse order. Since installing DDR3 RAM in a slot for DDR3L RAM will lead to incompatibility in electrical parameters and it will not start. Reverse replacement is possible, but an increased voltage value under DDR3 can lead to heating of the DDR3L RAM board.

How to choose RAM: video